MEMS Technology Platforms and Application Experience

IMT offers technology platforms and technology modules to reduce the development cycle and to reach production in the shortest time.  In addition to a comprehensive MEMS foundry services, IMT has an unparalleled breadth of applications experience:  

  • Surface and bulk MEMS devices
  • Electrostatic and electromagnetic actuators
  • Bi-stable devices
  • Microfluidics (2D and 3D) with integrated pumps and valves
  • Metal-filled through silicon vias (TSVs) for MEMS interposers and 3D packaging
  • Wafer-level packaging:  high-vacuum, hermetic packaging with various bonding technologies to meet device specific requirements (size, temperature budget, materials, etc.)

Find out how IMT can help you reduce the development cycle to take you to volume production in the shortest time.  For details on our MEMS wafer processing capabilities, please check out our MEMS Foundry Capabilities.

Platforms for Through Silicon Vias, Wafer-Level Packaging, and More

Through-Silicon Via (TSV)

  • Through silicon vias (TSVs) represent critical technology for the future in that they are a key enabler to reach large-scale 3D integration. IMT has been working with TSVs for years and is producing products today with nearly 140,000 hermetic metal-filled TSVs per wafer.
  • IMT's customers are using TSVs to reduce routing complexity, and increase integration while maintaining or in some cases, shrinking the footprint.
  • Copper TSVs can dramatically improve electrical performance – specifically required in the RF world. IMT's copper TSV technology offers:
    • • DC resistance of less than 0.01 ohms per via
      • Insertion loss of -0.01 dB at 6 GHz:
      • 15 µm diameter x 50 µm depth
      • 50 µm diameter x 250 µm depth
  • Based on your product specific design requirements, IMT's TSV platform offers fundamental basis for optimizing your customized solution.

MEMS Si Interposer with Multiple Re-distribution Layers

  • MEMS Si interposer is the next step in multi-layer PCB for 3D integration and wafer-level packaging, enabling electrical connectivity on extremely small footprint.
  • The interposers may contain complex electrical paths and circuits that re-route and/or re-characterize signals from the micro-device and in turn, interface with additional components or perhaps an entire system.
  • Lines and spaces are reduced by a factor of 10 from traditional PCB

Hermetic and Vacuum Wafer-Level Packaging (WLP)

  • Wafer-level packaging (WLP), once considered a feature in MEMS design and manufacturing has now become a requirement. With technology requirements converging, it is now commonplace to integrate what were once disparate process technologies and modules into single devices at the wafer level. In fact, more than 80% of programs at IMT implement WLP with some projects requiring as many as 5 wafers for integration and miniaturization. It is a key technology competency at IMT.
  • IMT implements materials such as silicon, glass, quartz, metals, and others to realize these devices, often mixing and matching other technology modules, such as IMT's through silicon vias (TSVs), to simplify routing and to signals to the outside world.
  • IMT routinely achieves over 99% hermeticity with its wafer level packages, including sub-mTorr vacuum WLP for applications that require high vacuum packaging.
  • IMT utilizes wafer-level packaging technology in several production programs that requires 4 and 5 wafers stacked together.
  • IMT differentiates itself by blazing the trail in complex integration of process and technologies though wafer-level packaging

Cell Sorter for Selectively Sorting Rare Blood Cells 

  • IMT's cell sorter system integrates reflective and refractive optics, 3D microfluidics, and high-speed electromagnetic actuation employing numerous materials in a 4 wafer stack. It is the most sophisticated device in the market using wafer-level packaging.
    • • Actuators and Pumps – producing  the fastest MEMS actuator traveling from 0 to 1.4 m/sec to 0 in 15 msec with a 22 µm stroke
      • Incorporates 3D microfluidics and 4 wafers bonded at wafer-level
  • High-speed, massively parallel sorting enables high purity cell therapy for cancer, autoimmune treatment, and radiation exposure

Cenfire® RF Switch Platform

  • The CenFire platform provides a high performance MEMS switch building block without the high cost and long lead time
  • The platform can be custom configured for SPST to SP4T
  • High performance 4 pole MEMS relay targeted at DC – 6 GHz and higher operating ranges


  • Microfluidics is the "cornerstone" technology for IMT.  Drug delivery, cell sorting and purification, cell synthesis, and ultra high-resolution particle characterization all implementing microfluidics. The means to precisely control and manipulate of fluids is enabled by components that can be implemented separately or integrated together to form an entire system. These components typically include:
      • Active and/or passive valves (reed, gate, etc.) activated mechanically or non-mechanically
      • Actuators used as the pump mechanism to move fluid through the microfluidics system
      • Electromagnetic
      • Piezoelectric
      • Electrostatic
      • Thermal
      • Complex 3D microfluidics channels and manifolds can be fabricated by using multiple bonded wafers
      • Micro-nozzles for precise application and distribution of fluids
  • Nearly all biotechnology and biomedical programs leverage one or more components of a microfluidics system. In addition, it is common for IMT to integrate microfluidics with optics and sensor technologies for a complex system.

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Silicon Optical Bench, MEMS Switching, and Sensors Experience

Biomedical and Biotechnology

  • Rare human cell sorting, cell filtration, and separation
  • Hazard detection
  • Drug delivery devices
    • Implantables, opthalmological
    • Both passive and active devices
  • Gene chips and detection systems proteomics, pharmacogenomics, and disease diagnostics
  • Particle detection – the most sensitive MEMS capable of measuring particle mass to the resolution of a femtogram (10-15) in fluid

Optical MEMS for Data and Telecommunications - Silicon Optical Bench, Variable Optical Attenuators, and Laser Submounts

  • IMT manufactures the most sophisticated optical communication MEMS devices in volume production
  • Silicon Optical Bench: 
    • Various features are etched into silicon with metallization and AuSn solder for attaching various components, i.e., mirror, laser diode, and lens all at wafer level
    • After all the components are assembled, the entire wafer can be bonded at wafer level to offer hermetic packaging
    • Thereafter, wafer can be singulated, tested for hermeticity, and shipped to customers for system integration
  • Waveguides:  IMT has experience fabricating waveguides using SiN, doped SiO2
  • Wavelength Select Switching (WSS): 
    • 96 x 1, 48 x 1, 12 x 1 MEMS micromirror arrays
    • Mirror arrays are used in Reconfigurable Optical Add/Drop Multiplexers (ROADM)
  • Variable Optical Attenuators (VOA):  single 1- or 2-axis MEMS micromirrors have low insertion loss and fast-actuation speed
  • Add/drop switches and 2 x 2 protection/rerouting switches, optical cross-connect (OXC)

RF and DC Switching

  • DC for Cu cross-connect for DSL application
  • RF MEMS switches for communications
  • 62 M+ working MEMS switches shipped and counting
  • Capacitive and metal-metal contact switching
  • Hermetic wafer-level packaging


  • Gas, chemical, optical, and environmental sensors for automated air quality monitoring and control
  • Gyros and accelerometers for commercial and consumer applications
  • Hermetic and high vacuum wafer-level packaging

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