IMT CEO Speaks on WLP and TSV Technologies for MEMS and Semiconductors
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John Foster, CEO of Innovative Micro Technology, was recently interviewed by Yole MicroNews regarding two key technologies for MEMS and semiconductor integration: Wafer-level packaging (WLP) and Through-Silicon Vias (TSV). In the interview, Dr. Foster addresses key aspects of the technologies for 3D heterogeneous integration, technical requirements for successful implementation, and applications of WLP/TSV in micro electromechanical

systems (MEMS) and semiconductor devices, including interposers. MEMS applications discussed include: optical and electrical switching (DC through RF and mm-wave), infra-red (IR) devices, navigation, and microfluidics. The complete interview can be found at

About Innovative Micro Technology
IMT is the world's leading MEMS contract manufacturer/foundry partner with a diversified range of customers and products. IMT was formed in 2000, specifically to produce MEMS (micro-electromechanical systems) devices. IMT's 130,000 sq ft facility contains a 30,000 sq ft Class 100 clean room/fab, the largest and best-equipped independent MEMS fab in the world. The company was built for volume manufacturing, and provides complete foundry services from design through production. IMT currently has >25 customers in diverse applications, including relays and relay arrays, drug discovery, drug delivery, biomedical implants and cell purifiers, microfluidics, displays, inertial navigation, optical telecommunications, printing, various sensors, night vision, IR emitters, telephone/DSL switching, RF devices, power management, and others. IMT's overriding goal is to partner with companies to develop and manufacturer products based on MEMS technology.

Contact Monteith Heaton: phone (805) 681-2852; fax (805) 967-2677, monte@imtmems.com, or visit www.imtmems.com.