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Technology Platforms and Application Experience


IMT offers technology platforms and technology modules to reduce the development cycle and to reach production in the shortest time.  In addition to a comprehensive MEMS foundry services, IMT has an unparalleled breadth of applications experience:  

  • Surface and bulk MEMS devices
  • Electrostatic and electromagnetic actuators
  • Bi-stable devices
  • Microfluidic devices and valving
  • Metal-filled through silicon vias (TSVs) for MEMS interposers and 3D packaging
  • Wafer-level packaging:  high-vacuum, hermetic packaging with various bonding technologies to meet device specific requirements (size, temperature budget, materials, etc.)


Find out how IMT can help you reduce the development cycle to take you quickly to volume production.

 

Technology Platforms

Through-Silicon Via (TSV)

  • Through silicon vias (TSVs) represent critical technology for the future in that they are a key enabler to reach large-scale 3D integration. IMT has been working with TSVs for years and is producing products today with nearly 140,000 hermetic metal-filled TSVs per wafer.
  • IMT's customers are using TSVs to reduce routing complexity, and increase integration while maintaining or in some cases, shrinking the footprint.
  • Copper TSVs can dramatically improve electrical performance – specifically required in the RF world. IMT's copper TSV technology offers:
    • • DC resistance of less than 0.01 ohms per via
      • Insertion loss of -0.01 dB at 6 GHz:
      • 15 µm diameter x 50 µm depth
      • 50 µm diameter x 250 µm depth
  • Based on your product specific design requirements, IMT's TSV platform offers fundamental basis for optimizing your customized solution.

MEMS Si Interposer

  • MEMS Si interposer is the next step in multi-layer PCB for 3D integration and wafer-level packaging, enabling electrical connectivity on extremely small footprint.
  • The interposers may contain complex electrical paths and circuits that re-route and/or re-characterize signals from the micro-device and in turn, interface with additional components or perhaps an entire system.
  • Lines and spaces are reduced by a factor of 10 from traditional PCB

 

Hermetic Wafer-Level Packaging (WLP)

  • Wafer-level packaging (WLP), once considered a feature in MEMS design and manufacturing has now become a requirement. With technology requirements converging, it is now commonplace to integrate what were once disparate process technologies and modules into single devices at the wafer level. In fact, more than 80% of programs at IMT implement WLP with some projects requiring as many as 5 wafers for integration and miniaturization. It is a key technology competency at IMT.
  • IMT implements materials such as silicon, glass, quartz, metals, and others to realize these devices, often mixing and matching other technology modules, such as IMT's through silicon vias (TSVs), to simplify routing and to signals to the outside world.
  • IMT routinely achieves over 99% hermeticity with its wafer level packages, including sub-mTorr vacuum WLP for applications that require high vacuum packaging.
  • IMT utilizes wafer-level packaging technology in several production programs that requires 4 and 5 wafers stacked together.
  • IMT differentiates itself by blazing the trail in complex integration of process and technologies though wafer-level packaging

 

NanoSorter® Rare Cell Sorting Platform

  • IMT's cell sorter system integrates reflective and refractive optics, 3D microfluidics, and high-speed electromagnetic actuation employing numerous materials in a 4 wafer stack. It is the most sophisticated device in the market using wafer-level packaging.
    • • Actuators and Pumps – producing  the fastest MEMS actuator traveling from 0 to 1.4 m/sec to 0 in 15 msec with a 22 µm stroke
      • Incorporates 3D microfluidics and 4 wafers bonded at wafer-level
  • High-speed, massively parallel sorting enables high purity cell therapy for cancer, autoimmune treatment, and radiation exposure

 

Cenfire® RF Switch Platform

  • The CenFire platform provides a high performance MEMS switch building block without the high cost and long lead time
  • The platform can be custom configured for SPST to SP4T
  • High performance 4 pole MEMS relay targeted at DC – 6 GHz and higher operating ranges

 

 

Microfluidics

  • Microfluidics is the "cornerstone" technology for IMT's Life Science Division and is fully supported by IMT's Foundry Division. IMT supports programs from drug delivery to cell sorting and purification to cell synthesis to ultra high-resolution particle characterization- all implementing microfluidics. The means of precise control and manipulation of fluids is enabled by components that can be implemented separately or integrated together to form an entire system. These components typically include:
      • Active and/or passive valves (reed, gate, etc.) activated mechanically or non-mechanically.
      • Actuators used as the pump mechanism to move fluid through the system.
      • Electromagnetic
      • Piezoelectric
      • Electrostatic
      • Thermal
      • Complex 3D microchannels can be fabricated by using multiple wafers to create 3D manifold structures.
      • Micro-nozzles for precise application and distribution of fluids
  • Nearly all IMT's Life Science programs leverage one or more components of a microfluidics system. In addition, it is common for IMT to integrate a full microfluidic system with optics and other technologies integrating up to 5 wafers using wafer-level packaging.


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Application Experience

Biomedical and Biotechnology

  • Rare human cell sorting, cell filtration, and separation
  • Hazard detection
  • Drug delivery devices
    • Implantables, opthalmological
    • Both passive and active devices
  • Gene chips and detection systems proteomics, pharmacogenomics, and disease diagnostics
  • Particle detection – the most sensitive MEMS capable of measuring particle mass to the resolution of a femtogram (10-15) in fluid

 

Infrared

  • IR focal plane arrays for night vision application
  • IR emitters for friend-or-foe application for military
  • High-vacuum wafer-level packaging

 

Optical Telecom

  • IMT manufactures the most sophisticated optical communication MEMS device in volume production
  • Planar Lightwave Circuits (PLC), Si Optical Bench platforms
  • Wide Spectrum Switching (WSS) – 96 x 1, 48 x 1, 12 x 1 arrays used in Reconfigurable Optical Add/Drop Multiplexers (ROADM)
  • Variable Optical Attenuators (VOA) – low insertion loss, fast-switching
  • Add/drop switches and 2 x 2 protection/rerouting switches, optical cross-connect (OXC)

 

RF and DC Switching

  • DC for Cu cross-connect for DSL application
  • MM wave RF switches for military and industrial applications from 40 GHz to 100 GHz+
  • 62 M+ working MEMS switches shipped and counting
  • Capacitive and metal-metal contact switching
  • Hermetic wafer-level packaging

 

Sensors

  • Gas, chemical, and environmental sensors
  • Automated air quality monitoring and control

 

Inertial Measurement

  • Gyro and accelerometers
  • From navigation grade military gyros to industrial applications


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