IMT is located in Santa Barbara, California.  It is one of the most beautiful places in the world, nestled between miles of beaches and mountains that motivates you to enjoy an active lifestyle in the beautiful natural environment.

Working for IMT will be exhilarating as you will be interacting with the top professionals in the MEMS industry — providing a fast, aggressive, results-oriented work environment that allows employees to flourish. 

Be one of the team members, and contribute to manufacturing the most complex MEMS devices in the world.  We make MEMS work.

Please click on the appropriate links below to apply — include a completed job application, cover letter, and current resume (Microsoft Word, PDF) to the Human Resources Department.

IMT is an equal opportunity employer, who strongly encourage women, minorities, individuals with disabilities and veterans to apply to all of our job openings. All qualified applicants will receive consideration for employment without regard to race, color, religion, gender, sexual orientation, gender identity, or national origin, age, disability status, Genetic Information & Testing, Family & Medical Leave, protected veteran status, or any other characteristic protected by law.


Associate CMP Engineer

  • General Description
    • Looking for an energetic, mechanically inclined person to develop and run CMP processes for wafer development and production programs
    • Candidate will be required to perform measurements, failure analysis, and statistical process monitoring
    • Candidate will be required to generate written process instructions and train technicians
    • Candidate may also participate in other wafer related activities within the manufacturing engineering department
  • Detailed Job Duties
    • Operation of wafer grinding tools, CMP lapping tools, and its ancillaries
    • Work with development and processes engineers to development new Grind/CMP processes
    • Perform Grind/CMP on development and production wafers
    • Investigates and provides corrective action for scraps and rework related to Grind/CMP
    • Documents process and provides training
    • Use of metrology equipment, such as optical thickness measurement tools, microscope gages, zoom scopes, contact profilers
    • Conduct some equipment maintenance as needed (e.g., oil changes, lapping pad replacement, grinding wheel change outs, blade replacements)
    • Responsible for keeping work area clean (includes mopping and wiping tools/surfaces)
    • Responsible for complying with quality systems procedures as required
  • Work Experience, Education, and Physical Requirements
    • 3 years’ experience in related technology, AS or BS degree a plus
    • Excellent analytical, verbal and communication skills required
    • Computer skills with both non-Windows and Windows operating systems required
    • Flexibility to adapt to rapidly changing priorities and responsibilities
    • Hands-on participation and strong sense of ownership
    • Mechanical aptitude
    • Required to read and understand any pertinent training or departmental procedure manuals
    • Ability to work in fast paced, high volume production environment
    • Ability to work without supervision
  • Job Code: 2016-CMP-01-01 [ Click to apply to this position ]

Plating Engineer I

  • General Description
    • IMT is looking for talented entry-level engineer with some experience in plating and wet etch operations, best if semiconductor or MEMS industries
    • Required hands-on experience in wet and instrumental analysis and electroplating operations
    • The work will take place at IMT’s semiconductor fabrication cleanroom in Santa Barbara, CA
  • Detailed Job Duties
    • Primary Responsibility: 
      • Perform wafer process start-ups for electroplating and wet etch per schedule
      • Provide process engineering support for process qualification as needed
      • Enter data in electronic control database
      • Follow ISO procedures
    • Secondary Responsibility:  Some support in thin film metrology, photolithography, vacuum and wafer bonding
  • Work Experience, Education, and Physical Requirements
    • Preferred 2+ years of experience and a degree in chemistry, chemical engineering, or other related field
    • Recent college graduate with strong background in electrochemistry will be considered
    • Very good verbal and communication skills; ability to describe issues in writing via the electronic database or via email
    • Experience with control software preferred
    • Experience working in ISO 9000 environments preferred
    • Must have good interpersonal skills, a team player
    • This position is for split shift:  afternoon and evenings, Monday through Friday
    • Consideration will be given for first shift applicants who demonstrate excellent aptitude
  • Job Code: 2015-PLATING-08-01 [ Click to apply to this position ]

Process Development Engineer

  • General Description
    • Develop the processes for MEMS fabrication to ensure quality, cost and efficiency requirements are met
    • Troubleshoot development problems with the fabrication process and take corrective action
    • Research the purchase of equipment or upgrades to existing equipment
    • Work closely with management and customers on technical issues and problem resolution
    • Compile and present data to management and customers during product development and production.
  • Detailed Job Duties
    • Evaluate, implement and monitor wafer fabrication processes and operating lithography, vacuum, electroplating, and wet etch systems for the development and production of MEMS products
    • Create process flow and DOEs
    • Create/edit/maintain necessary documentation
    • Monitor and improve the efficiency, output and safety of manufacturing processes through observations and measurements of data
    • Work closely with other Engineers and Technicians for quality control
    • Assume responsibility for safety/environmental issues and ongoing performance of processes
    • All other duties, as assigned
  • Work Experience, Education, and Physical Requirements
    • A minimum of 4 years hands-on experience in silicon and glass wafer processing
    • Experience with stepper-based photolithography, vacuum and wet processing, wafer to wafer bonding, microstructure electroplating
    • MEMS Testing methods, SEM and AFM characterization
    • PhD preferred but minimum of a MS/MA in a scientific discipline required
    • Great communication, interpersonal, and computer skills
    • Ability to work in both a clean room environment and office environment
    • Must be able to don and wear Personal Protective Equipment as required
  • Job Code: 2015-PDE-02-01 [ Click to apply to this position ]

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