| reactive
ion etching (rie and drie) |
| • |
PlasmaTherm RIE, VersaLock 700:
dielectric etching |
| • |
STS DRIE ICP (inductively coupled
plasma) system for ultra-smooth vertical walls with a wide range
of etched feature shapes: |
| |
| • |
2µm holes |
| • |
through-wafer etching |
| • |
close-tolerance electrostatic
combs |
| • |
upto 25:1 aspect ratio |
|
| • |
STS AOE (advanced oxide etcher) system for
fast dielectric etching |
| ion
milling |
| • |
Veeco cassette-to-cassette, RM
350 |
|
|
