| photolithography |
| • |
two Nikon 5x I-line reduction steppers: 0.3µm
resolution
|
| • |
Karl Suss 1x aligner: 1.5µm resolution
|
| • |
SVG coater track/spray coater/HMDS vapor prime
|
| • |
automated batch development systems
|
| • |
SemiTool automated resist stripper
|
| • |
KLA 8100 low voltage CD-SEM
|
| • |
IVS 120 optical overlay metrology |
| |
| photolithography
experience |
| • |
exposure |
| |
| • |
0.5µm to 20µm thick
resists |
| • |
Su-8 to 80µm thickness |
| • |
imaging down to 0.3µm |
| • |
double side exposure and
alignment (±5µm) |
|
| • |
resists |
| |
| • |
broad band and I-line |
| • |
positive and negative tone |
| • |
liftoff stencil |
| • |
Su-8 |
| • |
top and bottom anti-reflective
(ar) coatings |
| • |
photo definable low-k dielectrics |
|
| • |
softbake, post exposure bake, and
curing |
| |
| • |
hotplate and convection ovens |
| • |
e-beam curing |
|
| • |
develop: metal ion and metal ion
free developers |
| • |
critical dimension capability/control
|
| |
| • |
±0.3µm 1x aligner |
| • |
±0.1µm 5x stepper |
|
| • |
overlay capability/control
|
| |
| • |
±1µm 1x aligner |
| • |
±0.15µm 5x stepper |
|
