| deposition |
| • |
pvd and ion beam metal and dielectric
deposition, including reactive deposition: |
| |
| • |
rf diode |
| • |
rf magnetron |
| • |
dc magnetron |
| • |
collimated depositions (both
natural and physical) |
|
| • |
CVC cluster tool (metal and dielectric
deposition) |
| • |
Innotec dielectric deposition |
| • |
Endeavor metal deposition |
| • |
Veeco ibd (ion beam deposition)
system |
| • |
pe-cvd deposition system |
| • |
lp-cvd diffusion tube furnace |
| • |
thermal oxidation and annealing
furnaces |
| |
| deposition experience |
| • |
metals |
| |
| • |
nickel iron (45%/55% and
80/20) |
| • |
copper |
| • |
tantalum (alpha and beta) |
| • |
ruthenium |
| • |
cobalt iron |
| • |
cobalt tantalum zirconium |
| • |
platinum manganese |
| • |
nickel manganese |
| • |
chromium manganese palladium |
| • |
cobalt platinum |
| • |
gold |
| • |
chromium |
| • |
titanium, molybdenum, cobalt,
nickel |
| • |
aluminum |
| |
|
|
| • |
semiconductor |
|
|
| • |
dielectrics |
|
| • |
alumina (Al2O3): reactive
and pure |
| • |
silicon dioxide (SiO2) |
| • |
nickel oxide |
| • |
tantalum nitride (reactive) |
| • |
tantalum penoxide |
| • |
silicon nitride |
| |
|
|
| • |
dlc (diamond like coating) |
| |
|
| • |
capabilities |
| |
| • |
metals: nominal
thickness from 8 Angstroms to 1.5µm |
| • |
dielectrics: nominal thickness
from 100 Angstrom to 60µm |
|
