wafer bonding
• Karl Suss wafer aligner and bonding system
• capabilities
 
• anodic bonding
• glass frit bonding
• eutectic bonding
• fusion bonding
• polymer bonding
• solder
   
packaging
• wafer level packaging (WLP), including hermetic sealing
• through-wafer vias (TWV)/ through-silicon vias (TSV)
• automated stitch bonding
• ball bonding
•

ultrasonic wire bonding
• polymer die bonding
 
• conductive epoxy
• UV curing
• vacuum cure
• eutectic bonding
• precision assembly
• custom built assembly tooling and packaging
ksaligner
 wlp
twv
stitchbond
diebond		 custassy
injmold
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